Technical Program Committee
It is with great pleasure that we welcome you to the 15th Biomedical Engineering International Conference –BMEiCON2023, held in Tokyo, Japan. This is the fourth time that BMEiCON has organized in Japan. The first BMEiCON organized in Japan, BMEiCON 2010, happened in 13 year ago in Kyoto. The successive BMEiCON 2014 and BMEiCON 2017 held impressively in Fukuoka and Hokkaido respectively. Special thanks to our long friend Prof. Tohru Yaki and Prof. Kazuhiko Hamamoto that make these BMEiCON possible. Following the COVID19 pandemic, this year BMEiCON has received a number of submissions, a total of 123. After the reviewing process, the program selected 109 papers for the final presentation. BMEiCON 2023 technical programs will span the four days from October 28, 2023 – October 31, 2023, divided into 18 parallel sessions, 4 keynote speeches and one research networking event.
We would like to specially thank our technical program committees and reviewers for their dedicated work in the entire process of reviewing and selecting the papers in the final program. I am very much grateful to our keynote speakers, Prof. Hiroshi Kimura,Prof. Takafumi Suzuki, Prof. Tadayuki Akagi and Prof. Jamie A. O’Reilly for accepting my invitation, the publication chair , Dr. Adisorn Leelasantithum for dealing with IEEE Explore. We especially thank Prof. Tohru Yaki and Prof. Kazuhiko Hamamoto, the general chair and general co-chair, Prof. Hiroki Kurashige, local committee, and Dr. Sarinporn Visitsattapongse the financial chair for organizing the BMEiCON2023 conference in Tokyo, Japan.
Finally, we thank the authors, attendees, and session chairs for your continued support of the BMEiCON conference. We hope all of you enjoy the excellent conference program at BMEiCON 2023 as well as the scenic beauty and attractions of the conference venue at Tokyo, Japan.
Chuchart Pintavirooj, KMITL
Supan Tungjitkusolmun, KMITL
Supaporn Kiattsin, Mahidol University
Chanchai Thaijiam, Srinakarin Tharaviroj University
Kohzoh Yoshino, Kwansei Gakuin University, Japan
Technical Program committee